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Patent Assignment Details
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Reel/Frame:015108/0372   Pages: 3
Recorded: 03/18/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
08/17/1999
Application #:
08919242
Filing Dt:
08/28/1997
Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE ENCAPSULATED THEREWITH
2
Patent #:
Issue Dt:
11/30/1999
Application #:
09305453
Filing Dt:
05/06/1999
Title:
EPOXY RESIN COMPOSITIONS AND SEMICONDUCTOR DEVICES ENCAPSULATED THEREWITH
Assignor
1
Exec Dt:
03/10/2004
Assignee
1
6-1, OTEMACHI 2-CHOME CHIYODA-KU
TOKYO, JAPAN
Correspondence name and address
MILLEN WHITE ZELANO & BRANIGAN, P.C.
JOHN A. SOPP
2200 CLARENDON BOULEVARD, SUITE 1400
ARLINGTON, VIRGINIA 22201

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