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Patent Assignment Details
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Reel/Frame:015240/0453   Pages: 3
Recorded: 04/21/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10717355
Filing Dt:
11/19/2003
Publication #:
Pub Dt:
05/19/2005
Title:
Conductive bumps with insulating sidewalls and method for fabricating
Assignor
1
Exec Dt:
03/04/2004
Assignee
1
ROOM 51-103, TTSC/B100 195 SECTION 4, CHUNG HSING ROAD
CHUTUNG, HSINCHU,, TAIWAN 310 R.O.C.
Correspondence name and address
TUNG & ASSOCIATES
RANDY W. TUNG
838 W. LONG LAKE ROAD
SUITE 120
BLOOMFIELD HILLS, MICHIGAN 48302

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