Patent Assignment Details
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| Reel/Frame: | 015253/0688 | |
| Pages: | 3 |
| | Recorded: | 04/22/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/29/2006
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Application #:
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10742992
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Filing Dt:
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12/23/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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ETCHING METHOD AND APPARATUS FOR SEMICONDUCTOR WAFERS
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Assignee
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| 1-1 SHIBAURA 1-CHOME MINATO-KU, |
| TOKYO,, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, GARRETT &
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LLP
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1300 I STREET, NW
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WASHINGTON, DC 20005
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