Patent Assignment Details
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Reel/Frame: | 015385/0833 | |
| Pages: | 4 |
| | Recorded: | 05/26/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10853172
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Filing Dt:
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05/26/2004
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Publication #:
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Pub Dt:
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01/06/2005
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Title:
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Processing apparatus, method for fabrication of semiconductor device by using the processing apparatus, and semiconductor device fabricated by this method
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Assignees
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2-3 MARUNOUCHI 3-CHOME, CHIYODA-KU |
TOKYO 100-8331, JAPAN |
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6-3, NISHIOI 1-CHOME, SHINAGAWA-KU |
TOKYO 140-8601, JAPAN |
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Correspondence name and address
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MORGAN LEWIS & BOCKIUS LLP
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1111 PENNSYLVANIA AVENUE NW
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WASHINGTON, DC 20004
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