Patent Assignment Details
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Reel/Frame: | 015589/0568 | |
| Pages: | 2 |
| | Recorded: | 01/13/2005 | | |
Attorney Dkt #: | 6030341 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/26/2005
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Application #:
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10490484
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Filing Dt:
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03/23/2004
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Publication #:
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Pub Dt:
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10/21/2004
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Title:
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PACKAGE FOR ELECTRONIC PARTS, LID THEREOF, MATERIAL FOR THE LID AND METHOD FOR PRODUCING THE LID MATERIAL
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Assignees
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4-7-19, KITAHAMA, CHUO-KU |
OSAKA-SHI, OSAKA, JAPAN 541-0041 |
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1389, SHINZAIKE AZA KONO, HIRAOKA-CHO |
KAKOGAWA-SHI, HYOGO 675-0194, JAPAN |
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Correspondence name and address
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KEATING & BENNETT LLP
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JOSEPH R. KEATING, ESQ.
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10400 EATON PLACE
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SUITE 312
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FAIRFAX, VA 22030
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