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Patent Assignment Details
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Reel/Frame:015732/0456   Pages: 3
Recorded: 02/17/2005
Conveyance: CHANGE ASSIGNEE ADDRESS
Total properties: 3
1
Patent #:
Issue Dt:
02/20/2001
Application #:
09052104
Filing Dt:
03/31/1998
Title:
EPOXY RESIN COMPOSITION AND RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE
2
Patent #:
Issue Dt:
11/06/2001
Application #:
09469173
Filing Dt:
12/21/1999
Title:
EPOXY RESIN AND RESIN-SEALED TYPE SEMICONDUCTOR APPARATUS
3
Patent #:
Issue Dt:
03/16/2010
Application #:
10502450
Filing Dt:
01/13/2005
Publication #:
Pub Dt:
06/09/2005
Title:
HEAT INTEGRATED DISTILLATION COLUMN
Assignor
1
Exec Dt:
10/19/2004
Assignee
1
27-1, SHINKAWA 2-CHOME
CHUO-KU
TOKYO, JAPAN 104-8260
Correspondence name and address
FITCH, EVEN, TABIN & FLANNERY
KENDREW H. COLTON
1801 K STREET, NW, SUITE 401L
WASHINGTON, D.C. 20006-1201

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