Patent Assignment Details
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| Reel/Frame: | 015959/0353 | |
| Pages: | 2 |
| | Recorded: | 03/24/2005 | | |
| Attorney Dkt #: | aus920040141us1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10850401
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Filing Dt:
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05/20/2004
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Publication #:
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Pub Dt:
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11/24/2005
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Title:
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Thermal protection for a VLSI chip through reduced c4 usage
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Assignee
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| 2-6-21, MINAMI-AOYAMA |
| MINATO-KU, TOKYO, 107-0062, JAPAN |
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Correspondence name and address
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IBM CORPORATION
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ROBERT M. CARWELL
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INTELLECTUAL PROPERTY LAW
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11400 BURNET ROAD
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AUSTIN, TX 78758
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