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Patent Assignment Details
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Reel/Frame:015975/0838   Pages: 10
Recorded: 05/05/2005
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
08/14/2007
Application #:
11075273
Filing Dt:
03/07/2005
Publication #:
Pub Dt:
08/04/2005
Title:
RECYCLING OF A WAFER COMPRISING A MULTI-LAYER STRUCTURE AFTER TAKING-OFF A THIN LAYER
2
Patent #:
NONE
Issue Dt:
Application #:
11075324
Filing Dt:
03/07/2005
Publication #:
Pub Dt:
08/04/2005
Title:
Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer
Assignors
1
Exec Dt:
02/28/2005
2
Exec Dt:
02/28/2005
3
Exec Dt:
02/28/2005
4
Exec Dt:
02/28/2005
5
Exec Dt:
02/28/2005
Assignee
1
PARC TECHNOLOGIQUE DES FONTAINES
38190 BERNIN, FRANCE 38190
Correspondence name and address
ALLAN A. FANUCCI
1700 K STREET N.W.
WASHINGTON, DC 20006

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