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Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:016075/0892   Pages: 4
Recorded: 05/31/2005
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 7
1
Patent #:
Issue Dt:
09/05/2006
Application #:
10811979
Filing Dt:
03/30/2004
Publication #:
Pub Dt:
06/30/2005
Title:
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND METHOD FOR FORMING HIGH-DIELECTRIC-CONSTANT FILM
2
Patent #:
NONE
Issue Dt:
Application #:
10925988
Filing Dt:
08/26/2004
Publication #:
Pub Dt:
03/03/2005
Title:
Method for manufacturing semiconductor device
3
Patent #:
Issue Dt:
06/12/2007
Application #:
11002198
Filing Dt:
12/03/2004
Publication #:
Pub Dt:
09/01/2005
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
4
Patent #:
NONE
Issue Dt:
Application #:
11002246
Filing Dt:
12/03/2004
Publication #:
Pub Dt:
07/14/2005
Title:
Method for manufacturing semiconductor device
5
Patent #:
Issue Dt:
04/29/2008
Application #:
11002269
Filing Dt:
12/03/2004
Publication #:
Pub Dt:
08/18/2005
Title:
SEMICONDUCTOR DEVICE HAVING MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THEREOF
6
Patent #:
Issue Dt:
08/21/2007
Application #:
11003493
Filing Dt:
12/06/2004
Publication #:
Pub Dt:
01/12/2006
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
7
Patent #:
Issue Dt:
12/12/2006
Application #:
11009074
Filing Dt:
12/13/2004
Publication #:
Pub Dt:
08/11/2005
Title:
SEMICONDUCTOR DEVICE HAVING BONDING PAD ABOVE LOW-K DIELECTRIC FILM
Assignor
1
Exec Dt:
04/27/2005
Assignee
1
1753 SHIMONUMABE, NAKAHARA-KU
KAWASAKI
KANAGAWA, JAPAN 211-8668
Correspondence name and address
JEFFREY A. WYAND
700 THIRTEENTH STREET, N. W.
SUITE 300
WASHINGTON, DC 20005

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