Patent Assignment Details
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Reel/Frame: | 016212/0818 | |
| Pages: | 3 |
| | Recorded: | 01/21/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11040865
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Filing Dt:
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01/21/2005
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Publication #:
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Pub Dt:
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07/27/2006
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Title:
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Dual damascene interconnections employing a copper alloy at the copper/barrier interface
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Assignees
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7-35 KITASHINAGAWA 6-CHOME, SHINAGAWA-KU |
TOKYO, JAPAN |
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1 SONY DRIVE |
PARK RUDGE, NEW JERSEY 07656 |
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Correspondence name and address
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STUART H. MAYER
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MAYER FORTKORT & WILLIAMS, PC
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251 NORTH AVENUE WEST, 2ND FLOOR
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WESTFIELD, NJ 07090
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