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Patent Assignment Details
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Reel/Frame:016505/0478   Pages: 5
Recorded: 10/22/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10512205
Filing Dt:
10/22/2004
Publication #:
Pub Dt:
08/18/2005
Title:
Polishing method, polishing device, and method of manufacturing semiconductor equipment
Assignors
1
Exec Dt:
09/15/2004
2
Exec Dt:
09/09/2004
3
Exec Dt:
09/10/2004
4
Exec Dt:
09/17/2004
5
Exec Dt:
09/16/2004
6
Exec Dt:
09/15/2004
7
Exec Dt:
09/16/2004
Assignee
1
7-35 KITASHINAGAWA 6-CHOME, SHINAGAWA-KU
TOKYO, JAPAN
Correspondence name and address
HOLLAND & KNIGHT LLP
ROBERT J. DEPKE
131 S. DEARBORN STREET, 30TH FLOOR
CHICAGO, IL 60603

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