Patent Assignment Details
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| Reel/Frame: | 016870/0283 | |
| Pages: | 6 |
| | Recorded: | 08/05/2005 | | |
| Attorney Dkt #: | AI 383 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/21/2007
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Application #:
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11197470
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Filing Dt:
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08/05/2005
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Publication #:
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Pub Dt:
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02/23/2006
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Title:
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SEMICONDUCTOR CHIP MANUFACTURING METHOD, SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
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Assignees
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| 21, SAIIN MIZOSAKI-CHO, UKYO-KU |
| KYOTO-SHI, KYOTO 615-8585, JAPAN |
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| 4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO 100-6334, JAPAN |
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO 105-8001, JAPAN |
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Correspondence name and address
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RABIN & BERDO, PC
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1101 14TH STREET, NW
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SUITE 500
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WASHINGTON, DC 20005
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