Patent Assignment Details
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Reel/Frame: | 017229/0245 | |
| Pages: | 7 |
| | Recorded: | 11/09/2005 | | |
Attorney Dkt #: | X2007.0196 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/14/2009
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Application #:
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11270334
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Filing Dt:
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11/09/2005
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Publication #:
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Pub Dt:
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06/01/2006
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Title:
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SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, CHIP SIZE PACKAGE, AND METHODS OF MANUFACTURING AND INSPECTION THEREFOR
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Assignee
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C/O YAMAHA CORPORATION |
10-1, NAKAZAWA-CHO, HAMAMATSU-SHI |
SHIZUOKA-KEN, JAPAN |
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Correspondence name and address
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MICHAEL J. SCHEER
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DICKSTEIN SHAPIRO MORIN ET AL.
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1177 AVENUE OF THE AMERICAS
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41ST FLOOR
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NEW YORK, NY 10036-2714
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