Patent Assignment Details
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Reel/Frame: | 017429/0161 | |
| Pages: | 4 |
| | Recorded: | 04/06/2006 | | |
Attorney Dkt #: | 71450.00051 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11329223
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Filing Dt:
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01/11/2006
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Publication #:
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Pub Dt:
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07/20/2006
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Title:
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Semi-conducting resin composition, and wired circuit board
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Assignee
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1-2, SHIMO-HOZUMI 1-CHOME, IBARAKI-SHI |
OSAKA, JAPAN 567-8680 |
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Correspondence name and address
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AKERMAN SENTERFITT/JEAN C. EDWARDS, ESQ.
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801 PENNSYLVANIA AVENUE, NW, SUITE 600
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WASHINGTON, DC 20004
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