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Patent Assignment Details
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Reel/Frame:017939/0871   Pages: 2
Recorded: 05/26/2006
Attorney Dkt #:054358-5075
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/17/2009
Application #:
11441062
Filing Dt:
05/26/2006
Publication #:
Pub Dt:
12/07/2006
Title:
SOFT MOLD, METHOD OF MANUFACTURING THE SAME, AND PATTERNING METHOD USING THE SAME
Assignor
1
Exec Dt:
05/24/2006
Assignee
1
20 YOIDO-DONG, YONGDUNGPO-GU,
SEOUL, KOREA, REPUBLIC OF
Correspondence name and address
MORGAN LEWIS & BOCKIUS LLP
1111 PENNSYLVANIA AVENUE NW
WASHINGTON, DC 20004

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