Patent Assignment Details
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| Reel/Frame: | 018287/0237 | |
| Pages: | 4 |
| | Recorded: | 09/06/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/08/2010
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Application #:
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11516944
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Filing Dt:
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09/06/2006
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Publication #:
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Pub Dt:
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05/03/2007
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Title:
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A STRUCTURE FOR PROTECTING ELECTRONIC PACKAGING CONTACTS FROM STRESS
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Assignee
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| 195, SEC. 4, CHUNG HSING ROAD |
| HSINCHU, TAIWAN R.O.C. |
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Correspondence name and address
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OMKAR K. SURYADEVARA
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SILICON VALLEY PATENT GROUP LLP
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2350 MISSION COLLEGE BOULEVARD
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SUITE 360
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SANTA CLARA, CALIFORNIA 95054
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