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Reel/Frame:018305/0022   Pages: 3
Recorded: 09/14/2006
Attorney Dkt #:070456-0123
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11482101
Filing Dt:
07/07/2006
Publication #:
Pub Dt:
02/08/2007
Title:
Body for keeping a wafer, method of manufacturing the same and device using the same
Assignors
1
Exec Dt:
09/01/2006
2
Exec Dt:
09/01/2006
3
Exec Dt:
09/01/2006
4
Exec Dt:
09/01/2006
5
Exec Dt:
09/01/2006
Assignee
1
5-33, KITAHAMA 4-CHOME
CHUO-KU, OSAKA-SHI
OSAKA, 541-0041, JAPAN
Correspondence name and address
MCDERMOTT WILL & EMERY LLP
600 13TH STREET, N.W.
WASHINGTON, D. C. 20005-3096

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