Patent Assignment Details
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| Reel/Frame: | 018701/0591 | |
| Pages: | 4 |
| | Recorded: | 01/03/2007 | | |
| Attorney Dkt #: | 5158-063027 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11580683
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Filing Dt:
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10/13/2006
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Publication #:
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Pub Dt:
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05/03/2007
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Title:
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Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape
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Assignee
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| 1-11-1, OSAKI, SHINAGAWA-KU |
| TOKYO, JAPAN 141-8584 |
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Correspondence name and address
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RUSSELL D. ORKIN
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700 KOPPERS BUILDING; 436 SEVENTH AVENUE
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PITTSBURGH, PA 15219
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