Patent Assignment Details
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Reel/Frame: | 018753/0424 | |
| Pages: | 4 |
| | Recorded: | 01/12/2007 | | |
Attorney Dkt #: | 1018.1232101 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10582558
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Filing Dt:
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06/12/2006
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Publication #:
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Pub Dt:
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05/24/2007
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Title:
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Polymer composite formed article, printed wiring board using the formed article, and methods of producing them
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Assignee
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SENJYO BLDG., 4-8-16, NIHONBASHI-HONCHO, CHUO-KU |
TOKYO 103-8424, JAPAN |
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Correspondence name and address
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DAVID M. CROMPTON
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1221 NICOLLET AVENUE, SUITE 800
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MINNEAPOLIS, MN 55403-2420
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