Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 019738/0640 | |
| Pages: | 4 |
| | Recorded: | 08/23/2007 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE WRONG SERIAL NUMBER "11/713,909" PREVIOUSLY RECORDED ON REEL 019712 FRAME 0413. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT SERIAL NUMBER IS "11/713,099". |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/28/2015
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Application #:
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11713099
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Filing Dt:
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03/02/2007
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Publication #:
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Pub Dt:
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09/13/2007
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Title:
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Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
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Assignee
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| 1006 OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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Correspondence name and address
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KENJI KAMATA
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1130 CONNECTICUT AVE., N.W., SUITE 1100
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PANASONIC PATENT CENTER
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WASHINGTON, DC 20036
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