Patent Assignment Details
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| Reel/Frame: | 019923/0968 | |
| Pages: | 2 |
| | Recorded: | 09/21/2007 | | |
| Attorney Dkt #: | 07490/HG |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/07/2011
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Application #:
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11886973
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Filing Dt:
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09/21/2007
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Publication #:
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Pub Dt:
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02/26/2009
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Title:
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ALLOY FOR HEAT DISSIPATION OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE, AND METHOD OF MANUFACTURING ALLOY
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Assignees
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| 2-3, KAMISE-SHO, NIIGATA-SHI |
| NIIGATA 950-0063, JAPAN |
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| 2-3, UCHISAIWAI-CHO 2-CHOME |
| CHIYODA-KU, TOKYO 100-0011, JAPAN |
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Correspondence name and address
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FRISHAUF HOLTZ GOODMAN, ET AL.
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220 FIFTH AVENUE
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16TH FLOOR
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NEW YORK, NY 10001-7708
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