Patent Assignment Details
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| Reel/Frame: | 019981/0244 | |
| Pages: | 6 |
| | Recorded: | 10/05/2007 | | |
| Conveyance: | CORRECTIVE COVERSHEET TO CORRECT INVENTOR CHING-WEN HSIAO GIVEN NAME FROM CHIN TO CHLNG PREVIOUSLY RECORDED ON REEL 016808, FRAME 0467. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/13/2007
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Application #:
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11186840
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Filing Dt:
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07/22/2005
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Publication #:
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Pub Dt:
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01/26/2006
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Title:
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WAFER-LEVELED CHIP PACKAGING STRUCTURE AND METHOD THEREOF
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Assignee
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| NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG |
| HSINCHU, TAIWAN R.O.C. |
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Correspondence name and address
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RICHARD E. FICHTER
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BACON & THOMAS, PLLC
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625 SLATERS LANE FOURTH FLOOR
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ALEXANDRIA, VA 22314
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