Patent Assignment Details
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| Reel/Frame: | 020610/0101 | |
| Pages: | 3 |
| | Recorded: | 02/29/2008 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12007786
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Filing Dt:
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01/15/2008
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Publication #:
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Pub Dt:
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07/17/2008
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Title:
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Pre-polishing treatment solution for interconnect substrate, polishing method, and method and apparatus for manufacturing interconnect substrate
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Assignee
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| 11-1, HANEDA ASAHI-CHO, OHTA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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WENDEROTH LIND & PONACK, LLP
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ATTN: DAVID M. OVEDOVITZ, ESQ.
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2033 K STREET, NW
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SUITE 800
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WASHINGTON, DC 20006-1021
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