Patent Assignment Details
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| Reel/Frame: | 021787/0693 | |
| Pages: | 2 |
| | Recorded: | 11/05/2008 | | |
| Attorney Dkt #: | 251931-1120 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/15/2010
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Application #:
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12264983
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Filing Dt:
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11/05/2008
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Publication #:
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Pub Dt:
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11/19/2009
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Title:
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SEMICONDUCTOR CHIP PACKAGE STRUCTURE
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Assignee
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| 8F-1, NO. 36, TAIYUAN ST. |
| JHUBEI CITY |
| HSINCHU COUNTY, TAIWAN 302, R.O.C. |
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Correspondence name and address
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DANIEL R. MCCLURE
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600 GALLERIA PARKWAY, S.E.
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STE 1500
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ATLANTA, GA 30339-5994
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