Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 021895/0742 | |
| Pages: | 6 |
| | Recorded: | 11/26/2008 | | |
Attorney Dkt #: | 108298970US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/14/2010
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Application #:
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12323926
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Filing Dt:
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11/26/2008
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Publication #:
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Pub Dt:
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05/27/2010
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Title:
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MICROELECTRONIC DEVICE WAFERS INCLUDING AN IN-SITU MOLDED ADHESIVE, MOLDS FOR IN-SITU MOLDING ADHESIVES ON MICROELECTRONIC DEVICE WAFERS, AND METHODS OF MOLDING ADHESIVES ON MICROELECTRONIC DEVICE WAFERS
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Assignee
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8000 S. FEDERAL WAY, P.O. BOX 6 |
BOISE, IDAHO 83707-0006 |
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Correspondence name and address
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PERKINS COIE LLP PATENT-SEA
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PO BOX 1247
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PAUL T. PARKER
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SEATTLE, WA 98111-1247
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