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Reel/Frame:022061/0639   Pages: 3
Recorded: 12/30/2008
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/13/2013
Application #:
12308949
Filing Dt:
12/30/2008
Publication #:
Pub Dt:
07/23/2009
Title:
RESIN TRANSFER MOLDING DEVICE AND RESIN TRANSFER MOLDING METHOD
Assignors
1
Exec Dt:
12/22/2008
2
Exec Dt:
12/22/2008
3
Exec Dt:
12/22/2008
4
Exec Dt:
12/22/2008
Assignee
1
16-5, KONAN 2-CHOME, MINATO-KU
TOKYO 108-8215, JAPAN
Correspondence name and address
WENDEROTH, LIND & PONACK, L.L.P.
ATTN: DAVID M. OVEDOVITZ, ESQ.
2033 K STREET, N.W., SUITE 800
WASHINGTON, DC 20006-1021

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