Patent Assignment Details
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Reel/Frame: | 022159/0383 | |
| Pages: | 5 |
| | Recorded: | 01/27/2009 | | |
Attorney Dkt #: | 033036.140 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/01/2012
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Application #:
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11915806
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Filing Dt:
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01/27/2009
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Publication #:
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Pub Dt:
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07/02/2009
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Title:
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ENCAPSULATING RESIN COMPOSITION FOR PREAPPLICATION, SEMICONDUCTOR DEVICE MADE WITH THE SAME, AND PROCESS FOR PRODUCING THE SAME
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Assignee
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5-8, HIGASHI-SHINAGAWA 2-CHOME |
SHINAGAWA-KU, TOKYO, JAPAN 140-0002 |
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Correspondence name and address
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ROBERT G. WEILACHER
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1230 PEACHTREE STREET
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SUITE 3100, PROMENADE II
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ATLANTA, GA 30309
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