Patent Assignment Details
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Reel/Frame: | 022718/0488 | |
| Pages: | 3 |
| | Recorded: | 05/21/2009 | | |
Attorney Dkt #: | 191214/US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12515726
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Filing Dt:
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05/20/2009
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Publication #:
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Pub Dt:
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11/05/2009
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Title:
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SILICON STRUCTURE HAVING AN OPENING WHICH HAS A HIGH ASPECT RATIO, METHOD FOR MANUFACTURING THE SAME, SYSTEM FOR MANUFACTURING THE SAME, AND PROGRAM FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING ETCHING MASK FOR THE SILICON STRUCTURE
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Assignee
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1-10, FUSOCHO |
AMAGASAKI-SHI, HYOGO, JAPAN 660-0891 |
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Correspondence name and address
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DORSEY & WHITNEY LLP
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1420 FIFTH AVENUE
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SUITE 3400
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SEATTLE, WA 98101-4010
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