Patent Assignment Details
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| Reel/Frame: | 023021/0706 | |
| Pages: | 2 |
| | Recorded: | 07/29/2009 | | |
| Attorney Dkt #: | B-0904K |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/07/2012
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Application #:
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12511375
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Filing Dt:
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07/29/2009
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Publication #:
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Pub Dt:
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02/25/2010
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Title:
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METHOD OF TESTING INSULATION PROPERTY OF WAFER-LEVEL CHIP SCALE PACKAGE AND TEG PATTERN USED IN THE METHOD
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Assignee
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| 550-1 HIGASHIASAKAWA-CHO |
| HACHIOJI-SHI, TOKYO, JAPAN 193-8550 |
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Correspondence name and address
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KUBOTERA & ASSOCIATES, LLC
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200 DAINGERFIELD RD
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SUITE 202
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ALEXANDRIA, VA 22314
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