Patent Assignment Details
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| Reel/Frame: | 023570/0536 | |
| Pages: | 5 |
| | Recorded: | 11/25/2009 | | |
| Attorney Dkt #: | 1217-092874 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/06/2014
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Application #:
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12625862
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Filing Dt:
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11/25/2009
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Publication #:
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Pub Dt:
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06/03/2010
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Title:
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Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination
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Assignee
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| 23-23, HONCHO, ITABASHI-KU |
| TOKYO, JAPAN 173 0001 |
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Correspondence name and address
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THE WEBB LAW FIRM, P.C.
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700 KOPPERS BUILDING
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436 SEVENTH AVENUE
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PITTSBURGH, PA 15219
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