Patent Assignment Details
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| Reel/Frame: | 023660/0330 | |
| Pages: | 3 |
| | Recorded: | 12/16/2009 | | |
| Attorney Dkt #: | 6057-91901 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/29/2003
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Application #:
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10224360
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Filing Dt:
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08/21/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Title:
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METHOD FOR IMPROVING INTEGRATED CIRCUITS BONDING FIRMNESS
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Assignee
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| NO. 195, SEC. 4, CHUNG HSING RD. |
| CHUTUNG TOWN, HSINCHU HSIEN, TAIWAN |
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Correspondence name and address
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MEYERTONS,HOOD,KIVLIN,KOWERT & GOETZEL
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700 LAVACA
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SUITE 800
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AUSTIN, TX 78701
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