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Patent Assignment Details
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Reel/Frame:024733/0314   Pages: 23
Recorded: 07/23/2010
Conveyance: MERGER (SEE DOCUMENT FOR DETAILS).
Total properties: 14
1
Patent #:
Issue Dt:
06/29/2010
Application #:
11360808
Filing Dt:
02/24/2006
Publication #:
Pub Dt:
08/31/2006
Title:
SEMICONDUCTOR DEVICE
2
Patent #:
Issue Dt:
06/15/2010
Application #:
11444507
Filing Dt:
06/01/2006
Publication #:
Pub Dt:
03/22/2007
Title:
SEMICONDUCTOR MANUFACTURING METHOD
3
Patent #:
Issue Dt:
06/29/2010
Application #:
11683053
Filing Dt:
03/07/2007
Publication #:
Pub Dt:
09/13/2007
Title:
SEMICONDUCTOR DEVICE AND A METHOD OF INCREASING A RESISTANCE VALUE OF AN ELECTRIC FUSE
4
Patent #:
Issue Dt:
06/08/2010
Application #:
11730682
Filing Dt:
04/03/2007
Publication #:
Pub Dt:
08/09/2007
Title:
LEAD FRAME INCLUDING SUSPENDING LEADS HAVING TRENCHES FORMED THEREIN
5
Patent #:
Issue Dt:
07/20/2010
Application #:
11837168
Filing Dt:
08/10/2007
Publication #:
Pub Dt:
12/13/2007
Title:
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
6
Patent #:
Issue Dt:
03/16/2010
Application #:
11878666
Filing Dt:
07/26/2007
Publication #:
Pub Dt:
02/14/2008
Title:
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
7
Patent #:
Issue Dt:
06/01/2010
Application #:
12014313
Filing Dt:
01/15/2008
Publication #:
Pub Dt:
06/12/2008
Title:
SEMICONDUCTOR DEVICE HAVING PLURALITY OF LEADS
8
Patent #:
Issue Dt:
08/25/2009
Application #:
12027730
Filing Dt:
02/07/2008
Publication #:
Pub Dt:
09/04/2008
Title:
SEMICONDUCTOR PACKAGE CONFIGURATION WITH IMPROVED LEAD PORTION ARRANGEMENT
9
Patent #:
Issue Dt:
07/20/2010
Application #:
12170020
Filing Dt:
07/09/2008
Publication #:
Pub Dt:
11/20/2008
Title:
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
10
Patent #:
Issue Dt:
06/15/2010
Application #:
12194044
Filing Dt:
08/19/2008
Publication #:
Pub Dt:
01/08/2009
Title:
METHOD OF MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
11
Patent #:
Issue Dt:
06/29/2010
Application #:
12264970
Filing Dt:
11/05/2008
Publication #:
Pub Dt:
03/12/2009
Title:
MULTI-CHIP SEMICONDUCTOR DEVICE
12
Patent #:
Issue Dt:
07/20/2010
Application #:
12392171
Filing Dt:
02/25/2009
Publication #:
Pub Dt:
07/02/2009
Title:
SEMICONDUCTOR MANUFACTURING METHOD OF DIE PICK-UP FROM WAFER
13
Patent #:
Issue Dt:
06/29/2010
Application #:
12503674
Filing Dt:
07/15/2009
Publication #:
Pub Dt:
11/05/2009
Title:
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
14
Patent #:
Issue Dt:
06/22/2010
Application #:
12644968
Filing Dt:
12/22/2009
Publication #:
Pub Dt:
04/22/2010
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING THE SAME
Assignor
1
Exec Dt:
04/01/2010
Assignee
1
1753 SHIMONUMABE, NAKAHARA-KU KAWASAKI
KANAGAWA, JAPAN
Correspondence name and address
ANTONELLI, TERRY, STOUT & KRAUS, LLP
1300 N. 17TH STREET, SUITE 1800
ARLINGTON, VIRGINIA 22209

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