Patent Assignment Details
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| Reel/Frame: | 025125/0454 | |
| Pages: | 4 |
| | Recorded: | 10/12/2010 | | |
| Attorney Dkt #: | 106647.00004 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/21/2013
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Application #:
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12902527
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Filing Dt:
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10/12/2010
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Publication #:
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Pub Dt:
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04/21/2011
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Title:
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MULTI-CHIP MODULE
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Assignees
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588 |
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| 2-10-23 SHIN-YOKOHAMA, KOHOKU-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 222-0033 |
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Correspondence name and address
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SQUIRE, SANDERS & DEMPSEY L.L.P.
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8000 TOWERS CRESCENT DRIVE
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14TH FLOOR
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VIENNA, VA 22182-6212
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