Patent Assignment Details
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| Reel/Frame: | 025575/0667 | |
| Pages: | 4 |
| | Recorded: | 01/03/2011 | | |
| Attorney Dkt #: | HJP920080063US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/05/2012
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Application #:
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12644358
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Filing Dt:
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12/22/2009
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Publication #:
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Pub Dt:
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05/05/2011
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Title:
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HEAD-STACK ASSEMBLY INCLUDING HEAT-DISSIPATION AND IMPEDANCE-MATCHING STRUCTURE AND HARD-DISK DRIVE USING THE HEAD-STACK ASSEMBLY
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Assignee
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| LOCATELLIKADE 1, PARNASSUSTOREN |
| AMSTERDAM, NETHERLANDS 1076 AZ |
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Correspondence name and address
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HITACHI C/O WAGNER BLECHER LLP
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123 WESTRIDGE DR
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WATSONVILLE, CA 95076
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