Patent Assignment Details
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| Reel/Frame: | 025642/0866 | |
| Pages: | 4 |
| | Recorded: | 01/03/2011 | | |
| Attorney Dkt #: | 148159 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/16/2014
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Application #:
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13002449
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Filing Dt:
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01/03/2011
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Publication #:
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Pub Dt:
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06/02/2011
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Title:
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WAFER POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS
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Assignee
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| 6-2, OHTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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WILLIAM P. BERRIDGE
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OLIFF & BERRIDGE, PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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