Patent Assignment Details
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| Reel/Frame: | 025934/0060 | |
| Pages: | 4 |
| | Recorded: | 03/10/2011 | | |
| Attorney Dkt #: | SHIN24675(339243-14) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/24/2013
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Application #:
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13044834
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Filing Dt:
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03/10/2011
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Publication #:
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Pub Dt:
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09/22/2011
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Title:
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BONDING METHOD, BONDING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE UNSING THE SAME
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Assignee
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| 51-1, INADAIRA 2-CHOME |
| MUSASHIMURAYAMA-SHI |
| TOKYO, JAPAN 208-8585 |
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Correspondence name and address
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KATTEN MUCHIN ROSENMAN LLP
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575 MADISON AVENUE
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15TH FLOOR ROOM 1502
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NEW YORK, NY 10022-2585
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