Patent Assignment Details
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| Reel/Frame: | 025941/0131 | |
| Pages: | 5 |
| | Recorded: | 03/11/2011 | | |
| Attorney Dkt #: | R150 1130.1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/01/2014
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Application #:
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13046331
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Filing Dt:
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03/11/2011
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Publication #:
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Pub Dt:
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09/15/2011
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Title:
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Method of Forming a Via in a Semiconductor Device
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Assignee
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| 1753, SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI-SHI |
| KANAGAWA, JAPAN 211-8668 |
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Correspondence name and address
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WOMBLE CARLYLE SANDRIDGE & RICE, PLLC
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ATTN: IP DOCKETING
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P.O. BOX 7037
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ATLANTA, GA 30357-0037
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