Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 026019/0283 | |
| Pages: | 2 |
| | Recorded: | 03/25/2011 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2015
|
Application #:
|
13062408
|
Filing Dt:
|
03/04/2011
|
|
Publication #:
|
|
Pub Dt:
|
07/14/2011
| | | | |
|
Title:
|
LEAD, WIRING MEMBER, PACKAGE PART, METAL PART PROVIDED WITH RESIN AND RESIN-SEALED SEMICONDUCTOR DEVICE, AND METHODS FOR PRODUCING SAME
|
|
|
Assignee
|
|
|
|
|
| 1006 OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
|
|
Correspondence name and address
|
| |
YOSHINOBU IDOGAWA
|
| |
1130 CONNECTICUT AVE., N.W., SUITE 1100
|
| |
PANASONIC PATENT CENTER
|
| |
WASHINGTON, DC 20036
|
Search Results as of:
04/28/2024 05:00 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
