Patent Assignment Details
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| Reel/Frame: | 028101/0175 | |
| Pages: | 4 |
| | Recorded: | 04/02/2012 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13261199
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Filing Dt:
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04/02/2012
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Publication #:
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Pub Dt:
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08/09/2012
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Title:
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LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PART
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Assignee
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO 120-8555, JAPAN |
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Correspondence name and address
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MICHAEL TOBIAS
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1629 K ST N.W., SUITE 300
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WASHINGTON, D.C. 20006
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