Patent Assignment Details
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| Reel/Frame: | 028461/0724 | |
| Pages: | 2 |
| | Recorded: | 06/28/2012 | | |
| Attorney Dkt #: | 4593-399 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/04/2017
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Application #:
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13470432
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Filing Dt:
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05/14/2012
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Publication #:
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Pub Dt:
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10/03/2013
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Title:
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APPARATUS AND METHOD FOR FORMING ELECTRICAL SOLDER CONNECTIONS IN A DISK DRIVE UNIT
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Assignee
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| SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T. |
| HONG KONG, CHINA |
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Correspondence name and address
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NIXON & VANDERHYE, PC
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901 NORTH GLEBE ROAD, 11TH FLOOR
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ARLINGTON, VA 22203
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