Patent Assignment Details
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| Reel/Frame: | 029252/0224 | |
| Pages: | 4 |
| | Recorded: | 11/07/2012 | | |
| Attorney Dkt #: | 39599-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13668306
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Filing Dt:
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11/04/2012
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Publication #:
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Pub Dt:
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06/20/2013
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Title:
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SOLID-LIQUID INTERDIFFUSION BONDING STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF
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Assignees
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| NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, |
| HSINCHU, TAIWAN 31040 |
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| NO.1, ROOSEVELT RD. SEC. 4, |
| TAIPEI, TAIWAN |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY
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7F.-1, NO. 100, ROOSEVELT RD., SEC. 2,
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TAIPEI, 100 TAIWAN
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