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Reel/Frame:029902/0291   Pages: 14
Recorded: 02/28/2013
Attorney Dkt #:ARC920120094US1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/14/2016
Application #:
13781497
Filing Dt:
02/28/2013
Publication #:
Pub Dt:
05/26/2016
Title:
INTERCONNECT CIRCUITS AT THREE-DIMENSIONAL (3-D) BONDING INTERFACES OF A PROCESSOR ARRAY
Assignors
1
Exec Dt:
02/13/2013
2
Exec Dt:
02/12/2013
3
Exec Dt:
02/13/2013
4
Exec Dt:
02/13/2013
5
Exec Dt:
02/21/2013
6
Exec Dt:
02/12/2013
7
Exec Dt:
02/12/2013
8
Exec Dt:
02/12/2013
9
Exec Dt:
02/14/2013
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
SHERMAN & ZARRABIAN LLP (IBM2/IBM2-S)
1411 5TH STREET, SUITE 306
SANTA MONICA, CA 90401

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