Patent Assignment Details
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| Reel/Frame: | 029948/0776 | |
| Pages: | 3 |
| | Recorded: | 03/08/2013 | | |
| Attorney Dkt #: | 925-253 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/10/2006
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Application #:
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10318017
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Filing Dt:
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12/13/2002
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Publication #:
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Pub Dt:
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05/01/2003
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Title:
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METHOD OF THINNING SEMICONDUCTOR WAFER CAPABLE OF PREVENTING ITS FRONT FROM BEING CONTAMINATED AND BACK GRINDING DEVICE FOR SEMICONDUCTOR WAFERS
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Assignee
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| 22-22, NAGAIKE-CHO, ABENO-KU |
| OSAKA, JAPAN 545-5822 |
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Correspondence name and address
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HAROLD BURNAM, JR.
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901 NORTH GLEBE ROAD
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ELEVENTH FLOOR
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ARLINGTON, VA 22203
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