Patent Assignment Details
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| Reel/Frame: | 030302/0941 | |
| Pages: | 3 |
| | Recorded: | 04/29/2013 | | |
| Attorney Dkt #: | 1156 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/08/2015
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Application #:
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13261554
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Filing Dt:
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12/28/2012
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Publication #:
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Pub Dt:
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05/16/2013
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Title:
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BI-SN BASED HIGH-TEMPERATURE SOLDER ALLOY
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Assignee
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN |
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Correspondence name and address
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MICHAEL TOBIAS
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1629 K STREET NW
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SUITE 300
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WASHINGTON, DC 20006
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