Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 030506/0924 | |
| Pages: | 4 |
| | Recorded: | 05/29/2013 | | |
| Attorney Dkt #: | 88249.JP12-0219-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/31/2017
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Application #:
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13872381
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Filing Dt:
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04/29/2013
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Publication #:
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Pub Dt:
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05/29/2014
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Title:
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MULTILAYER CIRCUIT SUBSTRATE HAVING CORE LAYER WITH THROUGH-HOLE
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Assignee
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| 16-20, UENO 6-CHOME, TAITO-KU |
| TOKYO, JAPAN 110-0005 |
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Correspondence name and address
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MASAO YOSHIMURA, CHEN YOSHIMURA LLP
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333 W. EL CAMINO REAL
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SUITE 380
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SUNNYVALE, CA 94087
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