Patent Assignment Details
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| Reel/Frame: | 030515/0675 | |
| Pages: | 5 |
| | Recorded: | 05/30/2013 | | |
| Attorney Dkt #: | 4428U.000001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/03/2018
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Application #:
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13905821
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Filing Dt:
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05/30/2013
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Publication #:
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Pub Dt:
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12/12/2013
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Title:
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Solder paste for bonding micro components
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Assignee
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| ALMIT BLDG. 14-2, YAYOICHO 2-CHOME, NAKANO-KU |
| TOKYO, JAPAN 164-0013 |
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Correspondence name and address
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MCHALE & SLAVIN, P.A.
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2855 PGA BLVD
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PALM BEACH GARDENS, FL 33410
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