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Reel/Frame:031525/0831   Pages: 3
Recorded: 11/01/2013
Attorney Dkt #:12-ALCO-1107US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
14030092
Filing Dt:
09/18/2013
Publication #:
Pub Dt:
03/19/2015
Title:
INTEGRATED CIRCUIT VIA STRUCTURE AND METHOD OF FABRICATION
Assignor
1
Exec Dt:
09/16/2013
Assignee
1
AKASAKA BIZ TOWER
3-1 AKASAKA 5-CHROME
MINATO-KU, TOKYO, JAPAN 107-6325
Correspondence name and address
LEVEQUE IP LAW
241 E. 4TH STREET, #102
FREDERICK, MD 21701

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