Patent Assignment Details
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| Reel/Frame: | 031667/0873 | |
| Pages: | 10 |
| | Recorded: | 11/25/2013 | | |
| Attorney Dkt #: | Q206085 (JTC) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/25/2015
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Application #:
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13974962
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Filing Dt:
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08/23/2013
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Publication #:
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Pub Dt:
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02/27/2014
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Title:
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METHOD OF PRODUCING SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, METHOD OF PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
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Assignees
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| 27-1, SHINKAWA 2-CHOME |
| CHUO-KU, TOKYO, JAPAN |
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| 3-1, HONGO 7-CHOME |
| BUNKYO-KU, TOKYO, JAPAN 113-8654 |
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Correspondence name and address
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JOHN CALLAHAN, SUGHRUE MION, PLLC
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2100 PENNSYLVANIA AVE., NW, #800
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WASHINGTON, DC 20037
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