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Patent Assignment Details
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Reel/Frame:032192/0116   Pages: 2
Recorded: 02/11/2014
Attorney Dkt #:TESSERA 3.0-609 CON
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/13/2014
Application #:
13711091
Filing Dt:
12/11/2012
Publication #:
Pub Dt:
04/25/2013
Title:
MICROELECTRONIC PACKAGES WITH DUAL OR MULTIPLE-ETCHED FLIP-CHIP CONNECTORS
Assignor
1
Exec Dt:
06/15/2010
Assignee
1
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondence name and address
LDLK&M
600 SOUTH AVENUE WEST
WESTFIELD, NJ 07090

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