Patent Assignment Details
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| Reel/Frame: | 032923/0135 | |
| Pages: | 10 |
| | Recorded: | 05/19/2014 | | |
| Attorney Dkt #: | Q210964 (JTC) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14220669
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Filing Dt:
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03/20/2014
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Publication #:
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Pub Dt:
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07/24/2014
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Title:
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METHOD OF PRODUCING COMPOSITE WAFER AND COMPOSITE WAFER
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Assignees
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| 27-1, SHINKAWA 2-CHOME |
| CHUO-KU, TOKYO, JAPAN 104-8260 |
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| 3-1, KASUMIGASEKI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-8921 |
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Correspondence name and address
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JOHN CALLAHAN, SUGHRUE MION, PLLC
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2100 PENNSYLVANIA AVE., NW, #800
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WASHINGTON, DC 20037
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